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To design high density interconnects that break the current paradigm and enable new architectures.
Copper has been the industry standard for chip-to-chip interconnects since it was introduced by IBM back in 1997. Now, however, the computational demands of more complex systems like AI, machine learning, and cloud systems are too high: copper interconnects are creating bottlenecks thanks to sub-optimal latency and power consumption. Avicena Technology has developed a new system - it could be a game changer.
The company’s ‘LightBundle’ solution uses micro-LEDs to create ultra-dense, low-latency, low-cost, and low-power optical interconnects, thereby facilitating the kind of high-performance architecture that’s in increasingly high demand as digital infrastructure becomes more complex.
It’s a solution that’s attracted healthy funding from major players including Samsung Catalyst Fund and Cerberus Capital Management. This suggests substantial faith in Avicena Technology’s ambition that its technology could help unlock the future of distributed high-performance computing and disaggregated architecture. Although a relatively modest outfit for now, Avicena Technology’s advances could prove highly influential over the coming years.
Kirsty
Company Specialist at Welcome to the Jungle
Aug 2022
$25m
SERIES A
Nov 2019
$6.5m
EARLY VC
Bardia Pezeshki
(CEO)After his PhD in electrical engineering at Stanford, held various managerial roles at IBM's T.J. Watson Research Center and then SDL Inc. Subsequently served as CTO at Santur Corporation, and then CEO at Kaiam Corporation.
Rob Kalman
(CTO)Worked on photonic interconnects and optical subsystems at Optivision and ONI Systems, and has subsequently held various VP roles at Luminous Networks and Thryva (which he co-founded).
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