Senior Staff/Principal Electrical Engineer, Array Labs
Office located in Palo Alto, CA
3D imaging software
Job no longer available
3D imaging software
21-100 employees
Job no longer available
Office located in Palo Alto, CA
21-100 employees
Company mission
To provide high-quality 3D imagery on a global scale.
Role
Who you are
- Bachelor's degree in Electrical or Computer Engineering
- 11+ years of electrical engineering work experience in consumer electronics, power electronics, robotics, aerospace, automotive, and/or communications fields
- Familiarity with hardware engineering principles including requirements gathering, architecture/design, source control management, build processes, reviews, and testing methods
- Solid understanding of high-speed board design, simulation, and validation techniques
- Excellent teamwork and communication skills
- Learns new concepts rapidly, completely, and in a self-directed manner
- High levels of self-motivation and personal accountability
- Ability to work in a fast-paced environment under significant time constraints
- Experience with Schematic Capture and Board Layout using ECAD tools (Altium Designer, Allegro, ORCAD etc)
- To conform to U.S. Government space technology export regulations, including the International Traffic in Arms Regulations (ITAR) you must be a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. Department of State
Desirable
- Master's degree in Electrical or Computer Engineering
- 6+ years of experience designing and implementing mixed-signal circuit boards from concept through production using processors, FPGAs, Ethernet, multi-GHz Serdes, DRAM interfaces (DDR4), I2C, SPI, PCIE, RF-sampling ADCS/DACs (or RF transceiver modules), and power supply components
- 2+ years of experience in the full life cycle development (concept to production) of new hardware products
- Expertise in one or more of the following areas preferred: Signal Integrity, Thermal and/or EM simulations of board designs
- Hands-on experience designing heterogeneous computing platforms with various compute engines such as SoCs, FPGAs, GPUs, and MCUs interacting with a wide variety of peripherals and storage media (flash, DDR, SSDs, SD cards) over different high-speed serial and parallel interfaces
- Experience with high-speed transceivers (ADCs, DACs, mixed-signal modules) over JESD204 interfaces preferred
- Bonus points for having experience in designing daughter cards or base-boards with Xilinx/Intel FPGAs
- Proficient with design techniques to maintain signal integrity in high-density, high-speed designs
- Experience with RF and split analog/digital designs
- Experience with low-noise design and minimization of EMI/EMC
- Experience with complex board designs, such as high-speed interconnects, high-reliability designs, avionics, vehicle control systems, and/or motor & actuator control electronics
- Bonus points for experience in the development and test of satellite bus systems and space/flight hardware
- Experience with compliance testing or various regulatory requirements
- Experience in silicon (on-chip) and package power delivery network principles
- Experience using simulation tools such as ANSYS, CST, HFSS, Hspice, ADS, Hyperlynx, etc
- Experience using one or more analog simulation tools such as Cadence (Spectre), OrCAD, PSPICE, LTspice, etc
- Experience using Network Analyzers, oscilloscopes and probing techniques
What the job involves
- Own the design of complex electrical/electronic platforms all the way from initial architecture to final manufacturing. This includes requirements capture, system trade-offs, component selection, schematic capture, PCB layout, prototyping, hardware bring-up, debugging, manufacturing, and test
- Responsible for any electrical and power accommodations including EMI/EMC evaluation for hosting sensitive compute, RF, communications, and sensing payloads
- Rapid iteration prototyping and joint hardware/firmware development; partnering with software engineers to bring-up and test new hardware designs
- Implement data-driven hardware design improvements by analyzing data collected during testing (electrical, vibration, thermal, radiation) and on orbit
- Execute reviews of hardware design documentation, schematics, and test plans
Application process
- We will conduct three interviews via Zoom; the typical process takes around 2-4 weeks to complete from start to finish
Our take
3D imaging is a growing market important to a wide array of industries, including climate action, defence, and insurance analytics. However, data supply chains from the satellites that provide this imaging to the people processing it are slow and expensive. Array Labs is developing innovative satellite imaging that can be delivered to its users almost in real-time.
Array Labs has taken part in two reputable accelerators since it was founded in 2021, and is attracting investors thanks to its plans to create a multifunctional 3D imaging satellite constellation above the Earth. Whilst this idea has been in play for decades, it is only recently that the dataset technology has caught up with the concept, and Array Labs is paving the way.
There’s still much work to be done to realise Array's ultimate vision, but it has got off to a promising start and has good funding at its back. Taking on the work ahead of it will rely heavily on partnerships with preexisting satellite companies.
Kirsty
Company Specialist at Welcome to the Jungle
Insights
Few candidates hear
back within 2 weeks
Company
Funding (2 rounds)
Oct 2022
$5m
SEED
Mar 2022
$0.6m
SEED
Total funding: $5.6m
Company HQ
Old Palo Alto, Palo Alto, CA
Articles
Leadership
Andrew Peterson
(Co-Founder & CEO)Previously Senior Control Systems Engineer at Moog Space and Defense Group, GNC Engineer and Radar Software Engineer at General Atomics Aeronautical Systems.
Isaac Robledo
(Co-Founder, Strategy & GTM)Previously Associate at Sunstone Properties Trust, CMBS Associate at Morgan Stanley, Financial Analyst at JLL.
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