SoC Top-Level Physical Design Engineer, Tenstorrent
$100-500k
OTE
Building computers for AI
Open for applications
Building computers for AI
501-1000 employees
Open for applications
$100-500k
OTE
501-1000 employees
Company mission
To bring unique solutions to the problems facing AI and machine learning.
Role
Who you are
- A seasoned physical design engineer who thrives on complex, full-chip implementation challenges
- Expert at collaborating across disciplines, working effectively with architecture, RTL, and packaging teams
- Passionate about optimizing chip-level implementations for power, performance, and area
- Detail-oriented professional who drives design closure while maintaining quality and meeting aggressive schedules
- You excel at managing the complexity of full-chip physical design and want to deliver next-generation AI hardware
- 8+ years of top-level SOC physical design experience on complex, multi-million gate designs
- Deep expertise in hierarchical floorplanning, fabric implementation, power grid design, and global clock distribution
- Proven track record with bump planning, RDL implementation, and multi-voltage domain designs
- Mastery of timing closure, EM/IR analysis, and physical verification at the chip level
What the job involves
- Tenstorrent is seeking an exceptional Senior-level SoC Physical Design Engineer to drive top-level implementation of our complex AI and CPU SoC designs
- You'll orchestrate cross-disciplinary collaboration, implementing sophisticated floorplans, power grids, and clock networks while ensuring design closure at the chip level
- You will learn how to implement cutting-edge AI accelerators and high-performance CPUs at the SOC level
- Advanced techniques for chiplet integration and next-generation packaging co-design
- Strategies for optimizing massive designs with complex power domains and clock architectures
- Methods for driving successful chip-level closure through effective cross-functional collaboration
Our take
Advances in artificial intelligence apps, combined with a global chip shortage, are strong tailwinds for chip processor Tenstorrent. The semi-conducter developer is designing specialized chips for running artificial intelligence applications, building chips for what it calls "software 2.0".
The company’s unique approach is to build for this future software, which it believes will be written at a higher level. Combining this with conditional computing, Tenstorrent supports a scalable distributed network approach that is analogous to a human brain.
While the market for specialised AI hardware is destined to be gigantic, the company has to compete with a plethora of hopeful startups (as well as major tech companies like NVIDIA and Qualcomm). That said, Tenstorrent boasts an excellent trajectory so far, with its latest moves including unveiling its high-end Wormhole AI processors, and a partnership with LG which will see the development of chips for "Affectionate Intelligence".
Kirsty
Company Specialist at Welcome to the Jungle
Insights
52% employee growth in 12 months
Company
Funding (last 2 of 7 rounds)
Dec 2024
$693m
SERIES D
Jun 2024
$300m
LATE VC
Total funding: $1.3bn
Company HQ
Flemingdon Park, Toronto, ON
Leadership
Jim Keller
(CEO)Previously Senior VP of Silicon Engineering at Intel Corporation, VP of Autopilot Hardware Engineering at Tesla, Corporate VP and Chief Architect at AMD, and VP of Engineering at Apple.
Milos Trajkovic
(Co-Founder & Director of Hardware Engineering)Former Manager of Firmware Design Engineering at AMD, and FPGA design engineer at Signum Concepts.
Ivan Hamer
(Co-Founder)Former Consulting Software/Embedded Engineer at AMD, and Senior Software Developer at iNTERFACEWARE.
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