Senior Engineer of Mechanical Design, Tenstorrent
$100-500k
OTE
Office located in Santa Clara, CA
Building computers for AI
Be an early applicant
Building computers for AI
501-1000 employees
Be an early applicant
$100-500k
OTE
Office located in Santa Clara, CA
501-1000 employees
Company mission
To bring unique solutions to the problems facing AI and machine learning.
Role
Who you are
- Bachelor’s or Master’s degree in Mechanical Engineering or equivalent
- 5+ years of experience in mechanical design, preferably for high-performance electronics or AI computing systems
- Expertise in enclosure design for electronics, including integration with thermal management solutions
- Proficiency in CAD software (SolidWorks preferred), with experience in wire harness design and surfacing
- Strong knowledge of various manufacturing processes, including injection molding, die-casting, extrusions, stamping, and 3D printing
- Deep understanding of GD&T (Geometric Dimensioning and Tolerancing) and engineering drawing creation
- Excellent problem-solving skills with a strong analytical mindset
- Ability to travel internationally (up to 15% of the time) as required for supplier visits and critical design reviews
What the job involves
- We are seeking a Senior Mechanical Design Engineer to lead the design and productization of mechanical and thermal solutions for high-performance PCIe Cards and multi-chip Server systems
- This role requires a hands-on engineer who thrives in a fast-paced, cross-functional environment and can drive complex programs from concept to production
- We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting
- Design and validate advanced mechanical solutions for high-power AI computing systems, including PCIe Cards and multi-chip Server Systems
- Conduct Finite Element Analysis (FEA) simulations to ensure mechanical reliability, including PCB microstrain validation
- Manage complex BOMs and part lifecycles in a PLM system
- Collaborate with PCB engineers to ensure compatibility between PCB layouts and mechanical enclosures, thermal systems, and other critical components
- Oversee DFM (Design for Manufacturability) and DFA (Design for Assembly) efforts, working closely with suppliers to optimize part production and cost efficiency
- Work with world-class suppliers, contractors, and test labs to ensure high-quality manufacturing and testing processes
- Conduct product-level reliability testing, including vibration, shock, thermal cycling, and environmental testing, to validate design robustness
- Generate detailed design documentation, including engineering drawings, test reports, and design guidelines, and provide training as needed
- Lead design reviews and provide technical mentorship to junior engineers
Our take
Advances in artificial intelligence apps, combined with a global chip shortage, are strong tailwinds for chip processor Tenstorrent. The semi-conducter developer is designing specialized chips for running artificial intelligence applications, building chips for what it calls "software 2.0".
The company’s unique approach is to build for this future software, which it believes will be written at a higher level. Combining this with conditional computing, Tenstorrent supports a scalable distributed network approach that is analogous to a human brain.
While the market for specialised AI hardware is destined to be gigantic, the company has to compete with a plethora of hopeful startups (as well as major tech companies like NVIDIA and Qualcomm). That said, Tenstorrent boasts an excellent trajectory so far, with its latest moves including unveiling its high-end Wormhole AI processors, and a partnership with LG which will see the development of chips for "Affectionate Intelligence".
Kirsty
Company Specialist at Welcome to the Jungle
Insights
52% employee growth in 12 months
Company
Funding (last 2 of 7 rounds)
Dec 2024
$700m
SERIES D
Jun 2024
$300m
LATE VC
Total funding: $1.3bn
Company HQ
Flemingdon Park, Toronto, ON
Leadership
Jim Keller
(CEO)Previously Senior VP of Silicon Engineering at Intel Corporation, VP of Autopilot Hardware Engineering at Tesla, Corporate VP and Chief Architect at AMD, and VP of Engineering at Apple.
Milos Trajkovic
(Co-Founder & Director of Hardware Engineering)Former Manager of Firmware Design Engineering at AMD, and FPGA design engineer at Signum Concepts.
Ivan Hamer
(Co-Founder)Former Consulting Software/Embedded Engineer at AMD, and Senior Software Developer at iNTERFACEWARE.
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