Senior Staff Technical Program Manager, Tenstorrent
Hardware
More information about location
Building computers for AI
Open for applications
Building computers for AI
501-1000 employees
Open for applications
More information about location
501-1000 employees
Company mission
To bring unique solutions to the problems facing AI and machine learning.
Role
Who you are
- Bachelor’s Degree or higher in an Engineering field (EE, ME preferred) or related technical degree
- Minimum of 4 years working in a product design and/or validation role, with an additional 3+ years in a project lead or technical program manager (TPM) role
- Excellent written and verbal communication skills
- Excellent interpersonal and teamwork skills with the ability to influence, motivate, mentor, and lead team resources
- Practical technical knowledge related to PCB or Mechanical design, and Software/Firmware development, plus prior experience working with NPI Ops and ODMs
- Ability to prioritize and solve complex problems and implement solutions with available resources
- Excellent organizational, reasoning, planning, and motivational skills
- Self-starter; self-motivator; willing to do what it takes to get the job done
- Experience working with hardware, firmware, validation and NPI manufacturing engineering teams, and external suppliers, utilizing structured product development processes (PDP)
What the job involves
- As an engineering Technical Program Manager, you will manage cross-functional teams, planning and executing complex programs end-to-end
- You will own post-Silicon productization of high performance PCIe Cards and high power, multi-chip Server systems
- Working with key stakeholders, you will establish program objectives, key milestones, and resource requirements
- You will succeed through effective partnering and collaboration with product management, hardware, software, supply chain, and NPI teams
- Collaborates and negotiates with cross-functional stakeholders to define scope, schedule and resource needs to deliver to project objectives
- Creates and tracks project schedules; drives all key deliverables defined in the project including schedule, hardware performance targets (specifications), resource plans, sourcing and manufacturing deliverables, and test and validation activities
- Assesses and highlights risks and develops mitigation plans with stakeholders
- Ensures successful planning and cross-functional alignment on module and system-level testing, compliance/reliability testing, life testing, and any activity required as part of the product release
- Ensures good cross-functional communication (through effective meetings, email, and other means) to ensure coordination between Engineering functional areas and other departments
- Proactively communicates issues and manages the solution paths
- Ensures proper documentation is completed for each development activity, and that adequate documentation exists for product manufacturing and customer service teams (test procedures, drawings, BOMs – Build of Material)
- Creates reports and presentations as required to support internal and external program reviews
Our take
Advances in artificial intelligence apps, combined with a global chip shortage, are strong tailwinds for chip processor Tenstorrent. The semi-conducter developer is designing specialized chips for running artificial intelligence applications, building chips for what it calls "software 2.0".
The company’s unique approach is to build for this future software, which it believes will be written at a higher level. Combining this with conditional computing, Tenstorrent supports a scalable distributed network approach that is analogous to a human brain.
While the market for specialised AI hardware is destined to be gigantic, the company has to compete with a plethora of hopeful startups (as well as major tech companies like NVIDIA and Qualcomm). That said, Tenstorrent boasts an excellent trajectory so far, with its latest moves including unveiling its high-end Wormhole AI processors, and a partnership with LG which will see the development of chips for "Affectionate Intelligence".
Kirsty
Company Specialist at Welcome to the Jungle
Insights
Company
Funding (last 2 of 7 rounds)
Dec 2024
$700m
LATE VC
Jun 2024
$300m
LATE VC
Total funding: $1.3bn
Company values
- Collaboration
- Curiosity
- Commitment to Solving Hard Problems
Company HQ
Flemingdon Park, Toronto, ON
Articles
Leadership
Jim Keller
(CEO)Previously Senior VP of Silicon Engineering at Intel Corporation, VP of Autopilot Hardware Engineering at Tesla, Corporate VP and Chief Architect at AMD, and VP of Engineering at Apple.
Milos Trajkovic
(Co-Founder & Director of Hardware Engineering)Former Manager of Firmware Design Engineering at AMD, and FPGA design engineer at Signum Concepts.
Ivan Hamer
(Co-Founder)Former Consulting Software/Embedded Engineer at AMD, and Senior Software Developer at iNTERFACEWARE.
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