Senior Director of Platform Engineering, Tenstorrent
OEM Systems
More information about location
Building computers for AI
Open for applications
Building computers for AI
501-1000 employees
Open for applications
More information about location
501-1000 employees
Company mission
To bring unique solutions to the problems facing AI and machine learning.
Role
Who you are
- We welcome candidates at various experience levels for this role
- BS/MS in Engineering, Mathematics, Physics, Computer Science or equivalent experience
- 12+ overall years of work-related experience in compute-intensive development programs with knowledge of CPU/GPU functionality
- 5+ years of management and leadership experience
- Experience in HPC/AI system design and development, and preferably experience working with OEMs/ODMs and Data Center end users
- Experience with electrical, mechanical, and software engineering, having worked on product development programs that deliver complex computing and networking solutions for the HPC/AI market
- Strong written and oral communication skills with the ability to effectively collaborate with management and engineering
- Experience supporting customers/partners in technical engagements and managing teams to deliver technical solutions that meet customer’s needs
- Strong time-management and organization skills for coordinating multiple initiatives, priorities and implementations of new technology and products into very complex projects
What the job involves
- We are looking for a Senior Director of Solutions Engineering to lead a team of senior Customer Solutions Architects and Engineers on a wide variety of customer engagements
- In this role, you will work closely with customers, partners, and other Tenstorrent engineers to support applications and platforms that leverage Tenstorrent technology, that will be adopted across all industry segments
- In addition, you will be the trusted advisor for the solutions architects on your team, developing their technical expertise to effectively work with OEMs/ODMs, CSPs, and Data Center personnel for the realization and deployment of Tenstorrent’s enterprise product portfolio
- Partner with our industry and account teams to develop a keen understanding of customer goals, strategies, and technical needs as well as help to define and deliver high-value solutions meeting these needs
- Document what you know and teach others. This can vary from building targeted samples to writing whitepapers, blogs, and wiki articles, to simply working through hard problems with a customer on a whiteboard
- Recruit, train, and retain top talent from within Tenstorrent and across the industry to build a world-class team of experts
- Be an industry leader with a vision on integrating Tenstorrent technology into AI, HPC, and enterprise systems and networking architectures, for advanced applications both in the Datacenter and at the edge
- Leverage your team across the entire product development lifecycle on compute modules, baseboards, thermal-mechanical and industrial design elements for our ML/AI servers and data center clusters
Application process
- During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting
Our take
Advances in artificial intelligence apps, combined with a global chip shortage, are strong tailwinds for chip processor Tenstorrent. The semi-conducter developer is designing specialized chips for running artificial intelligence applications, building chips for what it calls "software 2.0".
The company’s unique approach is to build for this future software, which it believes will be written at a higher level. Combining this with conditional computing, Tenstorrent supports a scalable distributed network approach that is analogous to a human brain.
While the market for specialised AI hardware is destined to be gigantic, the company has to compete with a plethora of hopeful startups (as well as major tech companies like NVIDIA and Qualcomm). That said, Tenstorrent boasts an excellent trajectory so far, with its latest moves including unveiling its high-end Wormhole AI processors, and a partnership with LG which will see the development of chips for "Affectionate Intelligence".
Kirsty
Company Specialist at Welcome to the Jungle
Insights
Company
Funding (last 2 of 7 rounds)
Dec 2024
$700m
LATE VC
Jun 2024
$300m
LATE VC
Total funding: $1.3bn
Company values
- Collaboration
- Curiosity
- Commitment to Solving Hard Problems
Company HQ
Flemingdon Park, Toronto, ON
Articles
Leadership
Jim Keller
(CEO)Previously Senior VP of Silicon Engineering at Intel Corporation, VP of Autopilot Hardware Engineering at Tesla, Corporate VP and Chief Architect at AMD, and VP of Engineering at Apple.
Milos Trajkovic
(Co-Founder & Director of Hardware Engineering)Former Manager of Firmware Design Engineering at AMD, and FPGA design engineer at Signum Concepts.
Ivan Hamer
(Co-Founder)Former Consulting Software/Embedded Engineer at AMD, and Senior Software Developer at iNTERFACEWARE.
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